3D Glass Solutions Brings Advanced 3D Chip Packaging to India
First-of-its-kind glass substrate facility marks a major step in scaling next-generation semiconductor integration
3D Glass Solutions (3DGS) is taking a major step in its global expansion with the launch of India’s first advanced 3D semiconductor packaging facility, located in Odisha.
The project represents a milestone not only for the company, but for the broader semiconductor ecosystem. For the first time, advanced glass substrate-based packaging and 3D heterogeneous integration capabilities are being established in India—positioning the country within a more advanced segment of the global chip value chain.
The facility, developed through 3DGS’s Indian subsidiary, is designed as a vertically integrated advanced packaging unit, with applications spanning artificial intelligence, data centers, 5G/6G communications, automotive radar, aerospace, defense, and photonics.
As compute demand accelerates—driven by AI and increasingly complex systems—packaging has emerged as one of the most critical constraints in semiconductor performance. Technologies such as 3D heterogeneous integration, enabled by glass substrates, offer significant advantages in signal performance, thermal stability, and system-level efficiency.
This investment, totaling approximately ₹1,943 crore (~$230M), reflects both the scale of the opportunity and the strategic importance of advanced packaging in the next wave of semiconductor innovation. The facility is expected to begin commercial production by 2028, with full-scale output targeted by 2030.
Beyond technology, the expansion underscores a broader shift in the global semiconductor landscape. Countries are increasingly investing in domestic capabilities—not only in fabrication, but across the full value chain, including advanced packaging. India’s ambition to become a semiconductor hub is accelerating, and projects like this play a key role in building that foundation.
For 3DGS, the move marks an important step in scaling its proprietary glass-based platform globally—bringing next-generation integration capabilities closer to key markets and customers.
We are proud to support 3D Glass Solutions as they continue to push the boundaries of semiconductor innovation.
Congratulations to Babu Mandava and the entire 3DGS team on this important milestone.